ams OSRAM SX3 V4.3 MOS WAFER | TDC‑GP30YA / TDC‑GP30YD Ultrasonic Flow SoC Wafer, MPN:191940002A1
- TDC‑GP30YA
- Availability: In Stock
- ams OSRAM SX3 V4.3 wafer MPN 191940002A1, TDC‑GP30 bare‑die for ultrasonic water meter SoC, package‑able to TDC‑GP30YA / TDC‑GP30YD.
$2.90
SX3 V4.3 MOS WAFER | TDC‑GP30 Bare‑Die Wafer
OEM MPN: 191940002A1
Internal project code: SX3 V4.3
Corresponding finished parts: TDC‑GP30YA (QFN40), TDC‑GP30YD (QFN32) Ultrasonic Time‑of‑Flight Flow‑meter SoC
Key Identification Evidence
- Project code SX3: Internal ams / ScioSense documents & authorized agent materials confirm SX3 is exclusive project code for TDC‑GP30, no other IC shares this code.
- OEM part number 191940002A1: ams internal wafer stock code exclusively assigned to TDC‑GP30 bare‑die wafer, belongs only to TDC flow‑sensing product line.
Wafer & Packaging Notes
- Wafer marking: MOS WAFER, 480μm thickness, targeted for ultrasonic water & heat‑meter applications.
- Bare dies from SX3 wafer are identical in hardware. Different package molds produce TDC‑GP30YA(QFN40) and TDC‑GP30YD(QFN32).
- Firmware is NOT pre‑programmed on wafer; firmware is loaded after packaging assembly.
Excluded Part Numbers
Not UFC23, TDC‑GP22 or GPX series. UFC23 / TDC‑GP22 have independent internal project codes and no overlap with SX3.
Typical Applications: Ultrasonic water meter, heat meter, time‑of‑flight distance measurement.
